India’s Cabinet, chaired by Prime Minister Narendra Modi, has approved four additional semiconductor projects under the India Semiconductor Mission, expanding the country’s chip production drive to ten projects across six states, according to a press release by India’s Press Information Bureau.

The latest proposals — from SiCSem, Continental Device India (CDIL), 3D Glass Solutions, and Advanced System in Package (ASIP) Technologies — represent a combined investment of INR46bn ($552mn) and are expected to create 2,034 skilled jobs, alongside indirect employment in the electronics sector. Total approved investments under the mission now stand at about INR1.60 trillion.

SiCSem, partnering with UK-based Clas-SiC Wafer Fab, will set up India’s first commercial compound semiconductor fabrication unit in Bhubaneshwar, Odisha, with an annual capacity of 60,000 wafers and 96mn packaged units. Products will target defence, electric vehicles, railways, and renewable energy applications. US-based 3D Glass Solutions will establish an advanced packaging and embedded glass substrate plant in the same location, introducing glass interposers, silicon bridges, and 3D heterogeneous integration modules to India.

The facility aims to produce 69,600 glass panel substrates, 50mn assembled units, and 13,200 3DHI modules each year. ASIP Technologies, in collaboration with South Korea’s APACT, will launch a unit in Andhra Pradesh producing 96mn semiconductor packages annually for mobile, automotive, and consumer electronics.

In Punjab, CDIL will expand its Mohali facility to manufacture high-power discrete devices including MOSFETs, IGBTs, and Schottky diodes, with an annual output of 158.38mn units. Officials said the new capacity will strengthen India’s domestic chip supply chain while complementing its expanding chip design ecosystem.